Best deals on AMD and Intel motherboard and CPU combos! Now featuring all-in-one Skylake processor bundles for the latest line from Intel. These combos are the. Integration Overview for LGA 1. Boxed Intel. The overview has technical information intended to aid in system integration for LGA1. Product information can also be found in the product brief, frequently asked questions (FAQ), and selling guide for the Intel. Refer to the integration instructions for this different socket type if you have this processor. You can find those instructions at the bottom of this document under related topics. Contents: Click or the topic for details: The Boxed Intel. Additionally, see the following pages for additional steps required for enabling certain processor features: Boxed processor contents. Rugged Embedded Computer Solution Intel® Core Intel. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage. Older generation boxed Intel fan heat sinks contain built- in circuitry to control fan speed. They had a thermistor in the fan hub which measured the chassis ambient air temperature. The fan circuitry then adjusts the fan speed to properly cool the processor at the slowest speed allowable. This generational and chronological list of Intel processors attempts to present all of Intel's processors from the pioneering 4-bit 4004 (1971) to the present high. NH-U12S Ultra-Quiet Slim CPU Cooler with NF-F12 fan (27%) NH-D15 Dual Radiator Quiet CPU Cooler with two NH-A15 Fans (15%) NH-L9i Intel-only Low Profile Quiet CPU. Intel® Core Dell XPS 15 9560 review – Core i7 CPU, Nivida 1050 graphics and UHD screen configuration.If the chassis ambient temperature is cool, then the fan will run slower and quieter. If the ambient temperature is hot, the fan will run faster. This fan had to work in a variety of operating conditions so it had to be designed in such a way that it would cool the processor when running at its maximum power at any given ambient temperature (up to 3. In normal operating environments, the processor rarely reaches its maximum power rating. Under most conditions the fan is spinning faster and louder than necessary. The fan heat sink is required to work this way so that it will properly cool the CPU in all specified operating environments. Intel has been aware of customer concerns over increasing fan noise. Intel has now designed a fan speed control technology to take advantage of the fact that the processor is not always running at its maximum power. This was done by basing the fan speed control on actual CPU temperature and power usage. The speed of the new fan heat sink is controlled by the additional fourth wire of the fan cable (. There is a digital thermal sensor in the processor which measures actual CPU temperature. The processor sends information to the motherboard about its specific thermal requirements and the actual processor temperature. The motherboard then uses this information to optimally control the speed of the processor fan. Figure 2 shows the current fan speed curve (red) of a 3- wire, fan heat sink- thermistor based fan speed control. The additional curves in blue represent fan operations at lower CPU temperature and power consumption levels based on the 4- wire fan speed control fan heat sink. Figure 2. Internal chassis temperature effect on boxed processor variable speed fan heat sink noise. The . The acoustic benefits are reliant on the motherboard implementation of fan speed control. Intel has developed a motherboard based fan speed control called Intel. This new technology uses a PID controller that can measure the rate of change of the processor temperature, thus predicting when the processor will reach its maximum temperature. If implemented correctly by the motherboard manufacturer, the control algorithm will operate the processor fan at minimum speed under most operating conditions. Since Intel. Consult your motherboard manufacturer to see which motherboards they offer with support for Intel QST. A 4- wire fan does not guarantee a quieter system. If the processor is being used in a hot environment and is under heavy loads, the fan will have to run fast enough to properly cool the processor. The internal chassis temperature is required to be maintained at 3. Selecting the correct chassis (see Chassis Selection) and verifying proper thermal management is critical for integrating a high quality Boxed Intel. Boxed processor variable fan heat sink set points. For Boxed Intel. Recommended temperature for nominal operating environment. Y = 3. 5Recommended maximum internal chassis temperature for Boxed Intel. Processor box label. Identifying a boxed processor. Boxed processor specifications (or S- Specs) marked on the integrated heat spreader of the Intel. Using the Product Specifications and Comparisons and the information marked on the processor, a system integrator can verify the appropriate processor number, speed rating, stepping, lot number, serial number and other important information about the processor. The numbers marked on the processor should match the numbers on the processor box label (see Figure 3). If the processor is already installed in a computer system then use the Intel. The label on the box of the boxed processor (that has the processor number, speed information, test specification, and lot number) should be photocopied and taped to the inside of the chassis for reference. This will allow quick access to the information that is no longer available on the top of the processor when the heat sink is installed. If a system's processor is later upgraded or replaced, causing the photocopied information inside the chassis to have incorrect information, the photocopy should be replaced, removed, or visibly marked as obsolete to avoid confusion. Platform component selection. Motherboard selection. Motherboards used with the Intel. In general, look for a motherboard which uses the following chipsets and sockets: Intel. Motherboards may also require a BIOS update in order to support specific processors. PCGPCG is a processor power specification to help identify thermal solutions, power supplies, and chassis that will meet specific power requirements. The PCG mark can be found on the box label and engraved on the Integrated Heat Spreader (IHS) of the processor. PCG information for a specific processor can be found at the Product Specifications and Comparisons page. The PCG mark does not promise compatibility. The PCG mark specifies likely component compatibility with processor electrical requirements. Compatible chipset, BIOS, drivers, hardware, and operating system are required. Contact your hardware for specific support of the Intel. The fan power cable must be connected to the motherboard power header as shown in the processor installation notes (included in the boxed processor package). The motherboard 4- pin header uses two pins to supply +1. V (power) and GND (ground). The fan uses the third pin to transmit fan- speed information to motherboards. The fourth pin allows motherboards that support 4- wire fan- speed control to control the fan speed based on actual processor power consumption. The motherboard must have a 4- pin fan power header located close to the socket. Note. Refer to your motherboard manual for the location of the CPU fan power header. Chassis selection. Systems based on the Intel. Intel recommends system integrators using ATX form factor motherboards choose a chassis that complies with the ATX specification (revision 2. Likewise, system integrators using micro. ATX form factor motherboards should choose a chassis that complies with the micro. ATX specification (1. The chassis must also support a lower internal ambient temperature than many standard ATX and micro. ATX desktop chassis. The internal chassis temperature for systems based on Intel. Most chassis designed for the Intel. Intel tests chassis with the Boxed Intel. These chassis meet Intel's processor specifications with the Intel. It is strongly recommended that system integrators perform thermal testing on the chassis selected for each configuration of Intel. Each motherboard/platform may have additional requirements based on graphics cards, TV tuners, ADD2+, HDD, ODD, chassis fans, etc. Consult the motherboard and system component documentation to determine additional power supply requirements. Intel tests power supplies to determine a minimum level of electrical compliance. Consult the Tested Power Supply List for more information. Integrating systems based on the Intel. Microsoft Windows Vista* and Microsoft Windows XP* (with SP2) support the Intel. Additionally, Linux* distributions offer support for the processor. Other vendors may have support for the Intel. System integrators should verify that the operating system they have selected supports the Intel. No additional optimizations are required. With specific drivers that use the SSE4 instructions, graphics accelerators, audio hardware and software, and other system resources can experience substantial performance gain. Graphics card vendors typically highlight support changes with new driver releases. Download and install the latest drivers from the vendor's Web site. Also, verify that the driver version contains optimization for the Intel. In order to take advantage of Intel. Contact your software vendor for available Intel. System performance is greatly affected by proper operating system and driver installation processes. For example, it is important to install the latest Intel. System integrators should confirm Boxed Intel. System integrators who follow the guidelines in this document will experience higher customer satisfaction by providing higher quality systems. Prices are for direct Intel customers, typically represent 1,0. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.# of Cores. Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip). Processor Base Frequency. Processor Base Frequency describes the rate at which the processor's transistors open and close. Frequency is measured in gigahertz (GHz), or billion cycles per second. Cache. CPU Cache is an area of fast memory located on the processor. Refer to Datasheet for thermal solution requirements. Embedded Options Available. Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Max Memory Size (dependent on memory type)Max memory size refers to the maximum memory capacity supported by the processor. Memory Types. Intel. Note that ECC memory support requires both processor and chipset support. Processor Graphics . See the Intel. Peripheral Component Interconnect Express (or PCIe) is a high- speed serial computer expansion bus standard for attaching hardware devices to a computer. Highly threaded applications can get more work done in parallel, completing tasks sooner. Intel. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. Intel. Intel VT- d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments. Intel. Extended Page Tables in Intel. The value shown represents which Intel’s instruction set this processor is compatible with. Idle States. Idle States (C- states) are used to save power when the processor is idle. Conventional Intel Speed. Step. AES- NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. Intel. It enables an environment where applications can run within their own space, protected from all other software on the system. Execute Disable Bit . PAPre Active: Orders may be taken, but not scheduled, nor shipped. ACActive: This specific part is active. ENEnd of Life: Product End of Life notification has been published. NONo Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns. OBObsolete: Inventory available. No future supplies will be available. RPRetired Price: This specific part is no longer being manufactured or purchased and no inventory is available. RTRetired: This specific part is no longer being manufactured or purchased and no inventory is available. NINot Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments. QRQuality/Reliability Hold.
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